ReP USP - Resultado da busca

Filtros : "International Conference High Temperature Capillarity" Limpar

Filtros

Trabalho de evento-resumo
A comparison between wetting and spreading of Cu-Ag-Ti and Cu-Ag-Nb (2004)
Brandi, Sérgio Duarte
Source: HTC-2004. Abstracts. Conference titles: International Conference High Temperature Capillarity. Unidade: EP
Subjects: SOLDAGEM, CERÂMICA, BRASAGEM
A citação é gerada automaticamente e pode não estar totalmente de acordo com as normas
ABNT
BRANDI, Sérgio Duarte. A comparison between wetting and spreading of Cu-Ag-Ti and Cu-Ag-Nb. 2004, Anais.. Genova: Institute and Enterphases, National Research Council, 2004. Disponível em: https://repositorio.usp.br/directbitstream/f352a8eb-d1cf-44d5-bf14-2979abd4794b/BRANDI-2004-1376116-Acomparisonbetween.pdf. Acesso em: 06 maio 2024.
APA
Brandi, S. D. (2004). A comparison between wetting and spreading of Cu-Ag-Ti and Cu-Ag-Nb. In HTC-2004. Abstracts. Genova: Institute and Enterphases, National Research Council. Recuperado de https://repositorio.usp.br/directbitstream/f352a8eb-d1cf-44d5-bf14-2979abd4794b/BRANDI-2004-1376116-Acomparisonbetween.pdf
NLM
Brandi SD. A comparison between wetting and spreading of Cu-Ag-Ti and Cu-Ag-Nb [Internet]. HTC-2004. Abstracts. 2004 ;[citado 2024 maio 06 ] Available from: https://repositorio.usp.br/directbitstream/f352a8eb-d1cf-44d5-bf14-2979abd4794b/BRANDI-2004-1376116-Acomparisonbetween.pdf
Vancouver
Brandi SD. A comparison between wetting and spreading of Cu-Ag-Ti and Cu-Ag-Nb [Internet]. HTC-2004. Abstracts. 2004 ;[citado 2024 maio 06 ] Available from: https://repositorio.usp.br/directbitstream/f352a8eb-d1cf-44d5-bf14-2979abd4794b/BRANDI-2004-1376116-Acomparisonbetween.pdf
Trabalho de evento-resumo
A proposal of a state equation to determine contact angle of lead-free-solders on copper substrate (2004)
Carreira Neto, Manoel; Brandi, Sérgio Duarte
Source: HTC-2004. Abstracts. Conference titles: International Conference High Temperature Capillarity. Unidade: EP
Subjects: SOLDAGEM, COBRE
A citação é gerada automaticamente e pode não estar totalmente de acordo com as normas
ABNT
CARREIRA NETO, Manoel e BRANDI, Sérgio Duarte. A proposal of a state equation to determine contact angle of lead-free-solders on copper substrate. 2004, Anais.. Genova: Institute and Enterphases, National Research Council, 2004. Disponível em: https://repositorio.usp.br/directbitstream/c543f750-9013-4db5-a5eb-75e8d96d4b6a/BRANDI-2004-1376136-Aproposalofastate.pdf. Acesso em: 06 maio 2024.
APA
Carreira Neto, M., & Brandi, S. D. (2004). A proposal of a state equation to determine contact angle of lead-free-solders on copper substrate. In HTC-2004. Abstracts. Genova: Institute and Enterphases, National Research Council. Recuperado de https://repositorio.usp.br/directbitstream/c543f750-9013-4db5-a5eb-75e8d96d4b6a/BRANDI-2004-1376136-Aproposalofastate.pdf
NLM
Carreira Neto M, Brandi SD. A proposal of a state equation to determine contact angle of lead-free-solders on copper substrate [Internet]. HTC-2004. Abstracts. 2004 ;[citado 2024 maio 06 ] Available from: https://repositorio.usp.br/directbitstream/c543f750-9013-4db5-a5eb-75e8d96d4b6a/BRANDI-2004-1376136-Aproposalofastate.pdf
Vancouver
Carreira Neto M, Brandi SD. A proposal of a state equation to determine contact angle of lead-free-solders on copper substrate [Internet]. HTC-2004. Abstracts. 2004 ;[citado 2024 maio 06 ] Available from: https://repositorio.usp.br/directbitstream/c543f750-9013-4db5-a5eb-75e8d96d4b6a/BRANDI-2004-1376136-Aproposalofastate.pdf

Digital Library of Intellectual Production of Universidade de São Paulo 2012 - 2024